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dc.contributor.authorEnright, Ryan
dc.contributor.authorMiljkovic, Nenad
dc.contributor.authorNam, Youngsuk
dc.contributor.authorWang, Evelyn N.
dc.contributor.authorDou, Nicholas G.
dc.date.accessioned2014-02-18T19:48:19Z
dc.date.available2014-02-18T19:48:19Z
dc.date.issued2012-03
dc.identifier.isbn978-0-7918-5477-8
dc.identifier.urihttp://hdl.handle.net/1721.1/84987
dc.description.abstractCondensation is an important process in both emerging and traditional power generation and water desalination technologies. Superhydrophobic nanostructures promise enhanced condensation heat transfer by reducing the characteristic size of departing droplets via a surface-tension-driven mechanism [1]. In this work, we investigated a scalable synthesis technique to produce oxide nanostructures on copper surfaces capable of sustaining superhydrophobic condensation and characterized the growth and departure behavior of condensed droplets. Nanostructured copper oxide (CuO) films were formed via chemical oxidation in an alkaline solution. A dense array of sharp CuO nanostructures with characteristic heights and widths of ~1 μm and ~300 nm, respectively, were formed. A gold film was deposited on the surface and functionalized with a self-assembled monolayer to make the surfaces hydrophobic. Condensation on these surfaces was then characterized using optical microscopy (OM) and environmental scanning electron microscopy (ESEM) to quantify the distribution of nucleation sites and elucidate the growth behavior of individual droplets with a characteristic size of ∼1 to 10 μm at low supersaturations. Comparison of the observed behavior to a recently developed model for condensation on superhydrophobic surfaces [2, 3] suggests a restricted regime of heat transfer enhancement compared to a corresponding smooth hydrophobic surface due to the large apparent contact angles demonstrated by the CuO surface.en_US
dc.description.sponsorshipMassachusetts Institute of Technology. Undergraduate Research Opportunities Programen_US
dc.description.sponsorshipUnited States. Dept. of Energy. Office of Science (Solid-State Solar-Thermal Energy Conversion Center)en_US
dc.description.sponsorshipUnited States. Air Force Office of Scientific Research. Young Investigator Programen_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Award ECS-0335765)en_US
dc.language.isoen_US
dc.publisherASME Internationalen_US
dc.relation.isversionofhttp://dx.doi.org/10.1115/MNHMT2012-75277en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceNenad Miljkovicen_US
dc.titleCondensation on Superhydrophobic Copper Oxide Nanostructuresen_US
dc.typeArticleen_US
dc.identifier.citationEnright, Ryan, Nicholas Dou, Nenad Miljkovic, Youngsuk Nam, and Evelyn N. Wang. “Condensation on Superhydrophobic Copper Oxide Nanostructures.” In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 419. ASME International, 2012.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.approverMiljkovic, Nenaden_US
dc.contributor.mitauthorEnright, Ryanen_US
dc.contributor.mitauthorMiljkovic, Nenaden_US
dc.contributor.mitauthorNam, Youngsuken_US
dc.contributor.mitauthorWang, Evelyn N.en_US
dc.contributor.mitauthorDou, Nicholas G.en_US
dc.relation.journalProceedings of the ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transferen_US
dc.eprint.versionOriginal manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsEnright, Ryan; Dou, Nicholas; Miljkovic, Nenad; Nam, Youngsuk; Wang, Evelyn N.en_US
dc.identifier.orcidhttps://orcid.org/0000-0001-7045-1200
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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