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dc.contributor.authorMiljkovic, Nenad
dc.contributor.authorEnright, Ryan
dc.contributor.authorWang, Evelyn N.
dc.date.accessioned2014-02-19T15:59:43Z
dc.date.available2014-02-19T15:59:43Z
dc.date.issued2012-01
dc.date.submitted2011-12
dc.identifier.issn1936-0851
dc.identifier.issn1936-086X
dc.identifier.urihttp://hdl.handle.net/1721.1/85004
dc.description.abstractCondensation on superhydrophobic nanostructured surfaces offers new opportunities for enhanced energy conversion, efficient water harvesting, and high performance thermal management. These surfaces are designed to be Cassie stable and favor the formation of suspended droplets on top of the nanostructures as compared to partially wetting droplets which locally wet the base of the nanostructures. These suspended droplets promise minimal contact line pinning and promote passive droplet shedding at sizes smaller than the characteristic capillary length. However, the gas films underneath such droplets may significantly hinder the overall heat and mass transfer performance. We investigated droplet growth dynamics on superhydrophobic nanostructured surfaces to elucidate the importance of droplet morphology on heat and mass transfer. By taking advantage of well-controlled functionalized silicon nanopillars, we observed the growth and shedding behavior of suspended and partially wetting droplets on the same surface during condensation. Environmental scanning electron microscopy was used to demonstrate that initial droplet growth rates of partially wetting droplets were 6× larger than that of suspended droplets. We subsequently developed a droplet growth model to explain the experimental results and showed that partially wetting droplets had 4–6× higher heat transfer rates than that of suspended droplets. On the basis of these findings, the overall performance enhancement created by surface nanostructuring was examined in comparison to a flat hydrophobic surface. We showed these nanostructured surfaces had 56% heat flux enhancement for partially wetting droplet morphologies and 71% heat flux degradation for suspended morphologies in comparison to flat hydrophobic surfaces. This study provides insights into the previously unidentified role of droplet wetting morphology on growth rate, as well as the need to design Cassie stable nanostructured surfaces with tailored droplet morphologies to achieve enhanced heat and mass transfer during dropwise condensation.en_US
dc.description.sponsorshipUnited States. Dept. of Energy. Office of Basic Energy Sciences (Solid-State Solar-Thermal Energy Conversion Center)en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Award ECS-0335765)en_US
dc.language.isoen_US
dc.publisherAmerican Chemical Society (ACS)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1021/nn205052aen_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceNenad Miljkovicen_US
dc.titleEffect of Droplet Morphology on Growth Dynamics and Heat Transfer during Condensation on Superhydrophobic Nanostructured Surfacesen_US
dc.typeArticleen_US
dc.identifier.citationMiljkovic, Nenad, Ryan Enright, and Evelyn N. Wang. “Effect of Droplet Morphology on Growth Dynamics and Heat Transfer during Condensation on Superhydrophobic Nanostructured Surfaces.” ACS Nano 6, no. 2 (February 28, 2012): 1776-1785.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.approverMiljkovic, Nenaden_US
dc.contributor.mitauthorMiljkovic, Nenaden_US
dc.contributor.mitauthorEnright, Ryanen_US
dc.contributor.mitauthorWang, Evelyn N.en_US
dc.relation.journalACS Nanoen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsMiljkovic, Nenad; Enright, Ryan; Wang, Evelyn N.en_US
dc.identifier.orcidhttps://orcid.org/0000-0001-7045-1200
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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