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DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling

Author(s)
Sun, Chen; Kurian, George; Wei, Lan; Agarwal, Anant; Peh, Li-Shiuan; Stojanovic, Vladimir; Chen, Chia-Hsin; Miller, Jason E.; ... Show more Show less
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Abstract
With the rise of many-core chips that require substantial bandwidth from the network on chip (NoC), integrated photonic links have been investigated as a promising alternative to traditional electrical interconnects. While numerous opto-electronic NoCs have been proposed, evaluations of photonic architectures have thus-far had to use a number of simplifications, reflecting the need for a modeling tool that accurately captures the tradeoffs for the emerging technology and its impacts on the overall network. In this paper, we present DSENT, a NoC modeling tool for rapid design space exploration of electrical and opto-electrical networks. We explain our modeling framework and perform an energy-driven case study, focusing on electrical technology scaling, photonic parameters, and thermal tuning. Our results show the implications of different technology scenarios and, in particular, the need to reduce laser and thermal tuning power in a photonic network due to their non-data-dependent nature.
Date issued
2012-05
URI
http://hdl.handle.net/1721.1/85863
Department
delete; Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Journal
Proceedings of the 2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Sun, Chen, Chia-Hsin Owen Chen, George Kurian, Lan Wei, Jason Miller, Anant Agarwal, Li-Shiuan Peh, and Vladimir Stojanovic. “DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling.” 2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip (n.d.).
Version: Author's final manuscript
ISBN
978-1-4673-0973-8
978-0-7695-4677-3

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