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dc.contributor.authorChoi, Pilsoon
dc.contributor.authorGao, Jason Hao
dc.contributor.authorRamanathan, Nadesh
dc.contributor.authorMao, Mengda
dc.contributor.authorXu, Shipeng
dc.contributor.authorBoon, Chirn-Chye
dc.contributor.authorFahmy, Suhaib A.
dc.contributor.authorPeh, Li-Shiuan
dc.date.accessioned2014-09-18T15:05:24Z
dc.date.available2014-09-18T15:05:24Z
dc.date.issued2014-08
dc.identifier.isbn978-1-4503-2975-0
dc.identifier.urihttp://hdl.handle.net/1721.1/89796
dc.description.abstractWiFi cannot effectively handle the demands of device-to-device communication between phones, due to insufficient range and poor reliability. We make the case for using IEEE 802.11p DSRC instead, which has been adopted for vehicle-to-vehicle communications, providing lower latency and longer range. We demonstrate a prototype motivated by a novel fabrication process that deposits both III-V and CMOS devices on the same die. In our system prototype, the designed RF front-end is interfaced with a baseband processor on an FPGA, connected to Android phones. It consumes 0.02uJ/bit across 100m assuming free space. Application-level power control dramatically reduces power consumption by 47-56%.en_US
dc.description.sponsorshipSingapore-MIT Alliance for Research and Technologyen_US
dc.description.sponsorshipAmerican Society for Engineering Education. National Defense Science and Engineering Graduate Fellowshipen_US
dc.language.isoen_US
dc.publisherAssociation for Computing Machinery (ACM)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1145/2627369.2627644en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceMIT web domainen_US
dc.titleA Case for Leveraging 802.11p for Direct Phone-to-Phone Communicationsen_US
dc.typeArticleen_US
dc.identifier.citationPilsoon Choi, Jason Gao, Nadesh Ramanathan, Mengda Mao, Shipeng Xu, Chirn-Chye Boon, Suhaib A. Fahmy, and Li-Shiuan Peh. 2014. A case for leveraging 802.11p for direct phone-to-phone communications. In Proceedings of the 2014 international symposium on Low power electronics and design (ISLPED '14). ACM, New York, NY, USA, 207-212.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratoryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.mitauthorChoi, Pilsoonen_US
dc.contributor.mitauthorGao, Jason Haoen_US
dc.contributor.mitauthorPeh, Li-Shiuanen_US
dc.relation.journalProceedings of the 2014 International Symposium on Low Power Electronics and Design (ISLPED '14)en_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsChoi, Pilsoon; Gao, Jason Hao; Ramanathan, Nadesh; Mao, Mengda; Xu, Shipeng; Boon, Chirn-Chye; Fahmy, Suhaib A.; Peh, Li-Shiuanen_US
dc.identifier.orcidhttps://orcid.org/0000-0001-9010-6519
dc.identifier.orcidhttps://orcid.org/0000-0003-0856-9026
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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