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dc.contributor.authorDesai, Nachiket
dc.contributor.authorYoo, Jerald
dc.contributor.authorChandrakasan, Anantha P.
dc.date.accessioned2015-01-13T20:56:31Z
dc.date.available2015-01-13T20:56:31Z
dc.date.issued2013-02
dc.identifier.isbn978-1-4673-4516-3
dc.identifier.isbn978-1-4673-4515-6
dc.identifier.isbn978-1-4673-4514-9
dc.identifier.issn0193-6530
dc.identifier.urihttp://hdl.handle.net/1721.1/92839
dc.description.abstractAdvances in sensor design have made ambulatory health monitoring possible and have created the need for low-power communication systems to replace bulkier traditional links. Micropower sensors should also be powered by a non-local energy source for system miniaturization and long life. Recently proposed communication systems using wireless body area networks [1,2] and body-coupled communication [3] suffer from high path loss around the human body for efficient remote power delivery. In contrast, eTextiles are becoming an increasingly popular technology for efficiently powering and communicating with such sensors [4-6] due to wide coverage around the human body combined with low path loss and comfort of use.en_US
dc.description.sponsorshipMIT Masdar Program (Cooperative Agreement 196F/002/707/102f/70/9374)en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ISSCC.2013.6487702en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceChandrakasanen_US
dc.titleA scalable 2.9mW 1Mb/s eTextiles body area network transceiver with remotely powered sensors and bi-directional data communicationen_US
dc.typeArticleen_US
dc.identifier.citationDesai, N. V., J. Yoo, and A. P. Chandrakasan. “A Scalable 2.9mW 1Mb/s eTextiles Body Area Network Transceiver with Remotely Powered Sensors and Bi-Directional Data Communication.” 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (February 2013).en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverChandrakasan, Anantha P.en_US
dc.contributor.mitauthorDesai, Nachiketen_US
dc.contributor.mitauthorChandrakasan, Anantha P.en_US
dc.relation.journal2013 IEEE International Solid-State Circuits Conference Digest of Technical Papersen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsDesai, N. V.; Yoo, J.; Chandrakasan, A. P.en_US
dc.identifier.orcidhttps://orcid.org/0000-0002-5977-2748
dc.identifier.orcidhttps://orcid.org/0000-0002-6795-6440
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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