Irradiation damage of single crystal, coarse-grained, and nanograined copper under helium bombardment at 450 °C
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Author(s)
Han, Weizhong
Fu, Engang
Demkowicz, Michael J.
Wang, Yongqiang
Misra, Amit
Date Issued
October 2013
Journal
Journal of Materials Research
Publisher
Cambridge University Press (Materials Research Society)
Citation
Han, Weizhong, E.G. Fu, Michael J. Demkowicz, Yongqiang Wang, and Amit Misra. “Irradiation Damage of Single Crystal, Coarse-Grained, and Nanograined Copper Under Helium Bombardment at 450 °C.” J. Mater. Res. 28, no. 20 (October 2013): 2763–2770. © 2013 Materials Research Society
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Final published version
Abstract
The irradiation damage behaviors of single crystal (SC), coarse-grained (CG), and nanograined (NG) copper (Cu) films were investigated under Helium (He) ion implantation at 450 °C with different ion fluences. In irradiated SC films, plenty of cavities are nucleated, and some of them preferentially formed on growth defects or dislocation lines. In the irradiated CG Cu, cavities formed both in grain interior and along grain boundaries; obvious void-denuded zones can be identified near grain boundaries. In contrast, irradiation-induced cavities in NG Cu were observed mainly gathering along grain boundaries with much less cavities in the grain interiors. The grains in irradiated NG Cu are significantly coarsened. The number density and average radius of cavities in NG Cu was smaller than that in irradiated SC Cu and CG Cu. These experiments indicate that grain boundaries are efficient sinks for irradiation-induced vacancies and highlight the important role of reducing grain size in suppressing radiation-induced void swelling.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1557/jmr.2013.283
