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dc.contributor.authorYang, Nuo
dc.contributor.authorLuo, Tengfei
dc.contributor.authorEsfarjani, Keivan
dc.contributor.authorHenry, Asegun
dc.contributor.authorTian, Zhiting
dc.contributor.authorShiomi, Junichiro
dc.contributor.authorChalopin, Yann
dc.contributor.authorLi, Baowen
dc.contributor.authorChen, Gang
dc.date.accessioned2015-06-12T15:47:21Z
dc.date.available2015-06-12T15:47:21Z
dc.date.issued2015-02
dc.identifier.issn15461955
dc.identifier.issn15461963
dc.identifier.urihttp://hdl.handle.net/1721.1/97396
dc.description.abstractThe thermal interface conductance between Al and Si was simulated by a non-equilibrium molecular dynamics method. In the simulations, the coupling between electrons and phonons in Al are considered by using a stochastic force. The results show the size dependence of the interface thermal conductance and the effect of electron–phonon coupling on the interface thermal conductance. To understand the mechanism of interface resistance, the vibration power spectra are calculated. We find that the atomic level disorder near the interface is an important aspect of interfacial phonon transport, which leads to a modification of the phonon states near the interface. There, the vibrational spectrum near the interface greatly differs from the bulk. This change in the vibrational spectrum affects the results predicted by AMM and DMM theories and indicates new physics is involved with phonon transport across interfaces.en_US
dc.description.sponsorshipUnited States. Dept. of Energy. Office of Science (Solid-State Solar-Thermal Energy Conversion Center Award DE-SC0001299/DE-FG02-09ER46577)en_US
dc.description.sponsorshipNational Natural Science Foundation (China) (11334007)en_US
dc.description.sponsorshipNational Natural Science Foundation (China) (11204216)en_US
dc.language.isoen_US
dc.publisherAmerican Scientific Publishersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1166/jctn.2015.3710en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourcearXiven_US
dc.titleThermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulationsen_US
dc.typeArticleen_US
dc.identifier.citationYang, Nuo, Tengfei Luo, Keivan Esfarjani, Asegun Henry, Zhiting Tian, Junichiro Shiomi, Yann Chalopin, Baowen Li, and Gang Chen. “Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations.” Journal of Computational and Theoretical Nanoscience 12, no. 2 (February 1, 2015): 168–74.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorYang, Nuoen_US
dc.contributor.mitauthorTian, Zhitingen_US
dc.contributor.mitauthorChen, Gangen_US
dc.relation.journalJournal of Computational and Theoretical Nanoscienceen_US
dc.eprint.versionOriginal manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsYang, Nuo; Luo, Tengfei; Esfarjani, Keivan; Henry, Asegun; Tian, Zhiting; Shiomi, Junichiro; Chalopin, Yann; Li, Baowen; Chen, Gangen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-3968-8530
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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