Dense, low-power sensor network for three-dimensional thermal characterization of large-scale atria spaces
Author(s)
Gong, Nan-Wei; Ray, Steve; Ware, Gary; Leida, Brett; Ren, Tim; London, Phil; Paradiso, Joseph A.; Ware, Laura M.; Turza, Ashley K.; Way, David H.; Glicksman, Leon R.; ... Show more Show less
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We describe the design and implementation of a dense, low-power wireless sensor network for fine-grained three-dimensional thermal characterization of a large open indoor space. To better understand the airflow dynamics and ensuing energy efficiency potential of this type of modern architectural design, we developed a sustainable wireless mesh network consisting of 50 sensors hung on an array of thin cables in a 210 m[superscript 2], 14.2 m tall atrium for real-time temperature and humidity monitoring. The goal is to create compact wireless measurement sensor blocks for dense coverage in the building. We demonstrate the implementation through a preliminary analysis, which includes the evaluation of temperature distribution discrepancies with computer-simulated results and data taken during natural ventilation to illustrate the nontrivial, well-mixed temperatures observed during the studies.
Date issued
2012-10Department
Massachusetts Institute of Technology. Department of Architecture; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Massachusetts Institute of Technology. Department of Mechanical Engineering; Massachusetts Institute of Technology. Media Laboratory; Massachusetts Institute of Technology. Research Laboratory of ElectronicsJournal
2012 IEEE Sensors
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Gong, Nan-Wei, Laura Ware, Steve Ray, Gary Ware, Brett Leida, Tim Ren, Phil London, et al. “Dense, low-power sensor network for three-dimensional thermal characterization of large-scale atria spaces.” In 2012 IEEE Sensors, 1-4. Institute of Electrical and Electronics Engineers, 2012.
Version: Author's final manuscript
ISBN
978-1-4577-1767-3
978-1-4577-1766-6
978-1-4577-1765-9