High thermal conductivity ultra-high molecular weight polyethylene (UHMWPE) films
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Chen_High thermal conductivity.pdf
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Author(s)
Ghasemi, Hadi
Thoppey, Nagarajan
Huang, Xiaopeng
Loomis III, Robert James
Li, Xiaobo
Tong, Jonathan K.
Wang, Jianjian
Chen, Gang
Date Issued
May 2014
Journal
Proceedings of the Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Ghasemi, Hadi, Nagarajan Thoppey, Xiaopeng Huang, James Loomis, Xiaobo Li, Jonathan Tong, Jianjian Wang, and Gang Chen. “High Thermal Conductivity Ultra-High Molecular Weight Polyethylene (UHMWPE) Films.” Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (May 2014).
Version
Author's final manuscript
Abstract
Recently, high thermally conductive polymers have emerged as low cost and energy efficient alternatives to traditional use of metals in heat transfer applications. Here, we present development of ultra-high molecular weight polyethylene (UHMWPE) thin films with high thermal conductivity. The fabrication platform is based on a sol-gel process followed by mechanical drawing. After gel formation and partial drying, UHMWPE films are mechanically stretched at elevated temperatures, resulting in macroscopic plastic deformation as well as additional polymer chain alignment and crystallization. Both the extrusion and stretching procedures have been automated, and custom software incorporates parameter “recipes” to allow selection of a range of desired process variables. Structural characterization (XRD, DSC, and SEM) of these films suggests highly aligned polymer chains and crystallinity greater than 99%. The Angstrom method is utilized to measure in-plane thermal conductivity of these films along the drawing direction.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Creative Commons Attribution-Noncommercial-Share Alike
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DOI of Published Version
https://doi.org/10.1109/ITHERM.2014.6892287
