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dc.contributor.authorGhasemi, Hadi
dc.contributor.authorThoppey, Nagarajan
dc.contributor.authorHuang, Xiaopeng
dc.contributor.authorLoomis III, Robert James
dc.contributor.authorLi, Xiaobo
dc.contributor.authorTong, Jonathan K.
dc.contributor.authorWang, Jianjian
dc.contributor.authorChen, Gang
dc.date.accessioned2015-11-23T17:33:18Z
dc.date.available2015-11-23T17:33:18Z
dc.date.issued2014-05
dc.identifier.isbn978-1-4799-5267-0
dc.identifier.issn1087-9870
dc.identifier.urihttp://hdl.handle.net/1721.1/100007
dc.description.abstractRecently, high thermally conductive polymers have emerged as low cost and energy efficient alternatives to traditional use of metals in heat transfer applications. Here, we present development of ultra-high molecular weight polyethylene (UHMWPE) thin films with high thermal conductivity. The fabrication platform is based on a sol-gel process followed by mechanical drawing. After gel formation and partial drying, UHMWPE films are mechanically stretched at elevated temperatures, resulting in macroscopic plastic deformation as well as additional polymer chain alignment and crystallization. Both the extrusion and stretching procedures have been automated, and custom software incorporates parameter “recipes” to allow selection of a range of desired process variables. Structural characterization (XRD, DSC, and SEM) of these films suggests highly aligned polymer chains and crystallinity greater than 99%. The Angstrom method is utilized to measure in-plane thermal conductivity of these films along the drawing direction.en_US
dc.description.sponsorshipUnited States. Dept. of Energy (EERE/Office of Advanced Manufacturing Program Award DE-EE0005756)en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ITHERM.2014.6892287en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceHuangen_US
dc.titleHigh thermal conductivity ultra-high molecular weight polyethylene (UHMWPE) filmsen_US
dc.typeArticleen_US
dc.identifier.citationGhasemi, Hadi, Nagarajan Thoppey, Xiaopeng Huang, James Loomis, Xiaobo Li, Jonathan Tong, Jianjian Wang, and Gang Chen. “High Thermal Conductivity Ultra-High Molecular Weight Polyethylene (UHMWPE) Films.” Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (May 2014).en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.approverChen, Gangen_US
dc.contributor.mitauthorGhasemi, Hadien_US
dc.contributor.mitauthorThoppey, Nagarajanen_US
dc.contributor.mitauthorHuang, Xiaopengen_US
dc.contributor.mitauthorLoomis III, Robert Jamesen_US
dc.contributor.mitauthorLi, Xiaoboen_US
dc.contributor.mitauthorWang, Jianjianen_US
dc.contributor.mitauthorChen, Gangen_US
dc.contributor.mitauthorTong, Jonathan K.en_US
dc.relation.journalProceedings of the Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)en_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsGhasemi, Hadi; Thoppey, Nagarajan; Xiaopeng Huang, Nagarajan; Loomis, James; Xiaobo Li, James; Tong, Jonathan; Jianjian Wang, Jonathan; Chen, Gangen_US
dc.identifier.orcidhttps://orcid.org/0000-0003-0591-7056
dc.identifier.orcidhttps://orcid.org/0000-0001-9954-6895
dc.identifier.orcidhttps://orcid.org/0000-0002-3973-8067
dc.identifier.orcidhttps://orcid.org/0000-0002-3968-8530
dc.identifier.orcidhttps://orcid.org/0000-0001-7151-7355
dspace.mitauthor.errortrue
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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