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dc.contributor.authorJin, Donghyun
dc.contributor.authordel Alamo, Jesus A
dc.date.accessioned2017-04-13T17:40:08Z
dc.date.available2017-04-13T17:40:08Z
dc.date.issued2012-09
dc.date.submitted2012-08
dc.identifier.issn00262714
dc.identifier.urihttp://hdl.handle.net/1721.1/108117
dc.description.abstractWe have investigated the impact of high-power (HP) stress on the dynamic ON-resistance (RON) in high-voltage GaN High-Electron-Mobility Transistors (HEMTs). We use a newly proposed dynamic RON measurement methodology which allows us to observe RON transients after an OFF-to-ON switching event from 200 ns up to any arbitrary length of time over many decades. We find that HP-stress results in much worsened dynamic RON especially in the sub-ms range with minor changes on a longer time scale. We attribute this to stress-induced generation of traps with relatively short time constants. These findings suggest that accumulated device operation that reaches out to the HP state under RF power or hard-switching conditions can result in undesirable degradation of dynamic RON on a short time scale.en_US
dc.description.sponsorshipUnited States. Advanced Research Projects Agency-Energy. Agile Delivery of Electrical Power Technologyen_US
dc.description.sponsorshipSemiconductor Research Corporationen_US
dc.description.sponsorshipUnited States. Office of Naval Research. Design-for-Reliability Initiative for Future Technologies. Multidisciplinary University Research Initiative (ONR Grant)en_US
dc.language.isoen_US
dc.publisherElsevieren_US
dc.relation.isversionofhttp://dx.doi.org/10.1016/j.microrel.2012.08.023en_US
dc.rightsCreative Commons Attribution-NonCommercial-NoDerivs Licenseen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/en_US
dc.sourceProf. del Alamo via Chris Sherratten_US
dc.titleImpact of high-power stress on dynamic ON-resistance of high-voltage GaN HEMTsen_US
dc.typeArticleen_US
dc.identifier.citationJin, Donghyun, and Jesús A. del Alamo. “Impact of High-Power Stress on Dynamic ON-Resistance of High-Voltage GaN HEMTs.” Microelectronics Reliability 52, no. 12 (December 2012): 2875–2879.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.contributor.approverdel Alamo, Jesusen_US
dc.contributor.mitauthorJin, Donghyun
dc.contributor.mitauthordel Alamo, Jesus A
dc.relation.journalMicroelectronics Reliabilityen_US
dc.eprint.versionOriginal manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsJin, Donghyun; del Alamo, Jesús A.en_US
dspace.embargo.termsNen_US
mit.licensePUBLISHER_CCen_US
mit.metadata.statusComplete


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