Effect of multi-field plates on the reverse breakdown and leakage characteristics of GaN-on-silicon HEMTs
Author(s)
Boles, T.; Carlson, D.; Xia, L.; Kaleta, A.; McLean, C.; Jin, D.; Palacios, Tomas; Turner, George W.; Molnar, Richard J.; ... Show more Show less
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MACOM Technology Solutions has a continuing joint development efforts sponsored by the Department of Energy with MIT main campus and MIT Lincoln Laboratory to develop GaN on silicon three terminal high voltage/high current switching devices. The initial developmental goals were for a three terminal structure that has a reverse breakdown characteristic of >1200 volts and is capable of switching 10 amperes of current, with a current breakdown target of 3000 volts. This paper presents an update on the progress of this multi-year development project against these on-state current handling, reverse leakage and breakdown goals.
Date issued
2014-05Department
Lincoln Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer ScienceJournal
2014 International Conference on Compound Semiconductor Manufacturing Technology
Citation
Boles, T. et al. "Effect of Multi-Field Plates on GaN-on-Silicon HEMTs
Reverse Breakdown and Leakage Characteristics." 2014 International Conference on Compound Semiconductor Manufacturing Technology, 19-22 May, 2014, Denver, Colorado, CS ManTEch, 2014.
Version: Author's final manuscript