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dc.contributor.authorBoles, T.
dc.contributor.authorCarlson, D.
dc.contributor.authorXia, L.
dc.contributor.authorKaleta, A.
dc.contributor.authorMcLean, C.
dc.contributor.authorJin, D.
dc.contributor.authorPalacios, Tomas
dc.contributor.authorTurner, George W.
dc.contributor.authorMolnar, Richard J.
dc.date.accessioned2018-06-05T17:10:27Z
dc.date.available2018-06-05T17:10:27Z
dc.date.issued2014-05
dc.identifier.urihttp://hdl.handle.net/1721.1/116103
dc.description.abstractMACOM Technology Solutions has a continuing joint development efforts sponsored by the Department of Energy with MIT main campus and MIT Lincoln Laboratory to develop GaN on silicon three terminal high voltage/high current switching devices. The initial developmental goals were for a three terminal structure that has a reverse breakdown characteristic of >1200 volts and is capable of switching 10 amperes of current, with a current breakdown target of 3000 volts. This paper presents an update on the progress of this multi-year development project against these on-state current handling, reverse leakage and breakdown goals.en_US
dc.description.sponsorshipUnited States. Air Force (Contract FA8721-05-C-0002)en_US
dc.language.isoen_US
dc.relation.isversionofhttp://csmantech.org/OldSite/Conference%20Information/APfiles/2014/2014%20AP.pdfen_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceBaylonen_US
dc.titleEffect of multi-field plates on the reverse breakdown and leakage characteristics of GaN-on-silicon HEMTsen_US
dc.typeArticleen_US
dc.identifier.citationBoles, T. et al. "Effect of Multi-Field Plates on GaN-on-Silicon HEMTs Reverse Breakdown and Leakage Characteristics." 2014 International Conference on Compound Semiconductor Manufacturing Technology, 19-22 May, 2014, Denver, Colorado, CS ManTEch, 2014.en_US
dc.contributor.departmentLincoln Laboratoryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverPalacios, Tomasen_US
dc.contributor.mitauthorPalacios, Tomas
dc.contributor.mitauthorTurner, George W.
dc.contributor.mitauthorMolnar, Richard J.
dc.relation.journal2014 International Conference on Compound Semiconductor Manufacturing Technologyen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsBoles, T.; Carlson, D.; Xia, L.; Kaleta, A.; McLean, C.; Jin, D.; Palacios, T.; Turner, G. W.; Molnar, R. J.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-2190-563X
mit.licenseOPEN_ACCESS_POLICYen_US


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