dc.contributor.author | Boles, T. | |
dc.contributor.author | Carlson, D. | |
dc.contributor.author | Xia, L. | |
dc.contributor.author | Kaleta, A. | |
dc.contributor.author | McLean, C. | |
dc.contributor.author | Jin, D. | |
dc.contributor.author | Palacios, Tomas | |
dc.contributor.author | Turner, George W. | |
dc.contributor.author | Molnar, Richard J. | |
dc.date.accessioned | 2018-06-05T17:10:27Z | |
dc.date.available | 2018-06-05T17:10:27Z | |
dc.date.issued | 2014-05 | |
dc.identifier.uri | http://hdl.handle.net/1721.1/116103 | |
dc.description.abstract | MACOM Technology Solutions has a continuing joint development efforts sponsored by the Department of Energy with MIT main campus and MIT Lincoln Laboratory to develop GaN on silicon three terminal high voltage/high current switching devices. The initial developmental goals were for a three terminal structure that has a reverse breakdown characteristic of >1200 volts and is capable of switching 10 amperes of current, with a current breakdown target of 3000 volts. This paper presents an update on the progress of this multi-year development project against these on-state current handling, reverse leakage and breakdown goals. | en_US |
dc.description.sponsorship | United States. Air Force (Contract FA8721-05-C-0002) | en_US |
dc.language.iso | en_US | |
dc.relation.isversionof | http://csmantech.org/OldSite/Conference%20Information/APfiles/2014/2014%20AP.pdf | en_US |
dc.rights | Creative Commons Attribution-Noncommercial-Share Alike | en_US |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-sa/4.0/ | en_US |
dc.source | Baylon | en_US |
dc.title | Effect of multi-field plates on the reverse breakdown and leakage characteristics of GaN-on-silicon HEMTs | en_US |
dc.type | Article | en_US |
dc.identifier.citation | Boles, T. et al. "Effect of Multi-Field Plates on GaN-on-Silicon HEMTs
Reverse Breakdown and Leakage Characteristics." 2014 International Conference on Compound Semiconductor Manufacturing Technology, 19-22 May, 2014, Denver, Colorado, CS ManTEch, 2014. | en_US |
dc.contributor.department | Lincoln Laboratory | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
dc.contributor.approver | Palacios, Tomas | en_US |
dc.contributor.mitauthor | Palacios, Tomas | |
dc.contributor.mitauthor | Turner, George W. | |
dc.contributor.mitauthor | Molnar, Richard J. | |
dc.relation.journal | 2014 International Conference on Compound Semiconductor Manufacturing Technology | en_US |
dc.eprint.version | Author's final manuscript | en_US |
dc.type.uri | http://purl.org/eprint/type/ConferencePaper | en_US |
eprint.status | http://purl.org/eprint/status/NonPeerReviewed | en_US |
dspace.orderedauthors | Boles, T.; Carlson, D.; Xia, L.; Kaleta, A.; McLean, C.; Jin, D.; Palacios, T.; Turner, G. W.; Molnar, R. J. | en_US |
dspace.embargo.terms | N | en_US |
dc.identifier.orcid | https://orcid.org/0000-0002-2190-563X | |
mit.license | OPEN_ACCESS_POLICY | en_US |