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dc.contributor.authorKim, Daekeun
dc.contributor.authorSo, Peter T. C.
dc.date.accessioned2019-02-21T18:24:12Z
dc.date.available2019-02-21T18:24:12Z
dc.date.issued2015-05
dc.identifier.issn0146-9592
dc.identifier.issn1539-4794
dc.identifier.urihttp://hdl.handle.net/1721.1/120522
dc.description.abstractA 3D lithographic microfabrication process has been developed that is high throughput, scalable, and capable of producing arbitrary patterns. It offers the possibility for industrial scale manufacturing of 3D microdevices such as photonic crystals, tissue engineering scaffolds, and microfluidics chips. This method is based on depth-resolved wide-field illumination by temporally focusing femtosecond light pulses. We characterized the axial resolution of this technique, and the result is consistent with the theoretical prediction. As proof-of-concept experiments, we demonstrated photobleaching of 3D resolved patterns in a fluorescent medium and fabricating 3D microstructures with SU-8 photoresist.en_US
dc.description.sponsorshipDeshpande Center for Technological Innovation (Massachusetts Institute of Technology. School of Engineering)en_US
dc.description.sponsorshipSingapore-MIT Alliance for Research and Technology (SMART)en_US
dc.publisherThe Optical Societyen_US
dc.relation.isversionofhttp://dx.doi.org/10.1364/OL.35.001602en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourcePMCen_US
dc.titleHigh-throughput three-dimensional lithographic microfabricationen_US
dc.typeArticleen_US
dc.identifier.citationKim, Daekeun, and Peter T. C. So. “High-Throughput Three-Dimensional Lithographic Microfabrication.” Optics Letters 35, no. 10 (May 6, 2010): 1602.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorKim, Daekeun
dc.contributor.mitauthorSo, Peter T. C.
dc.relation.journalOptics Lettersen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2019-01-03T16:57:59Z
dspace.orderedauthorsKim, Daekeun; So, Peter T. C.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0003-4698-6488
mit.licenseOPEN_ACCESS_POLICYen_US


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