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dc.contributor.authorZheng, Jiabao
dc.contributor.authorLienhard, Benjamin
dc.contributor.authorBersin, Eric Alexander
dc.contributor.authorEnglund, Dirk R.
dc.date.accessioned2020-03-24T15:31:33Z
dc.date.available2020-03-24T15:31:33Z
dc.date.issued2019-05-06
dc.identifier.issn2045-2322
dc.identifier.urihttps://hdl.handle.net/1721.1/124230
dc.description.abstractNanodiamonds hosting colour centres are a promising material platform for various quantum technologies. The fabrication of non-aggregated and uniformly-sized nanodiamonds with systematic integration of single quantum emitters has so far been lacking. Here, we present a top-down fabrication method to produce 30.0 ± 5.4 nm uniformly-sized single-crystal nanodiamonds by block copolymer self-assembled nanomask patterning together with directional and isotropic reactive ion etching. We show detected emission from bright single nitrogen vacancy centres hosted in the fabricated nanodiamonds. The lithographically precise patterning of large areas of diamond by self-assembled masks and their release into uniformly sized nanodiamonds open up new possibilities for quantum information processing and sensing.en_US
dc.description.sponsorshipUnited States. Department of Energy. Office of Basic Energy Sciences ( Contract No. DE-SC0012704)en_US
dc.language.isoen
dc.publisherSpringer Science and Business Media LLCen_US
dc.relation.isversionof10.1038/s41598-019-43304-5en_US
dc.rightsCreative Commons Attribution 4.0 International licenseen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceScientific Reportsen_US
dc.subjectMultidisciplinaryen_US
dc.titleTop-down fabrication of high-uniformity nanodiamonds by self-assembled block copolymer masksen_US
dc.typeArticleen_US
dc.identifier.citationZheng, Jiabao et al. "Top-down fabrication of high-uniformity nanodiamonds by self-assembled block copolymer masks." Scientific reports 9(2019): 6914 © 2019 The Author(s)en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.relation.journalScientific reportsen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2020-02-20T16:50:59Z
dspace.date.submission2020-02-20T16:51:01Z
mit.journal.volume9en_US
mit.journal.issue1en_US
mit.licensePUBLISHER_CC
mit.metadata.statusComplete


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