Discrete Integrated Circuit Electronics (DICE)

Author(s)
Fredin, Z; Zemanek, J; Blackburn, C; Strand, E; Abdel-Rahman, A; ... Show more
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Abstract
© 2020 IEEE. We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.
Date issued
2020
URI
https://hdl.handle.net/1721.1/137149
Department
Center for Brains, Minds, and Machines
Journal
2020 IEEE High Performance Extreme Computing Conference, HPEC 2020
Publisher
IEEE
Citation
Fredin, Z, Zemanek, J, Blackburn, C, Strand, E, Abdel-Rahman, A et al. 2020. "Discrete Integrated Circuit Electronics (DICE)." 2020 IEEE High Performance Extreme Computing Conference, HPEC 2020.
Version: Author's final manuscript
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