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dc.contributor.authorFredin, Z
dc.contributor.authorZemanek, J
dc.contributor.authorBlackburn, C
dc.contributor.authorStrand, E
dc.contributor.authorAbdel-Rahman, A
dc.contributor.authorRowles, P
dc.contributor.authorGershenfeld, N
dc.date.accessioned2021-11-02T18:06:11Z
dc.date.available2021-11-02T18:06:11Z
dc.date.issued2020
dc.identifier.urihttps://hdl.handle.net/1721.1/137149
dc.description.abstract© 2020 IEEE. We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.en_US
dc.language.isoen
dc.publisherIEEEen_US
dc.relation.isversionof10.1109/HPEC43674.2020.9286236en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceMIT web domainen_US
dc.titleDiscrete Integrated Circuit Electronics (DICE)en_US
dc.typeArticleen_US
dc.identifier.citationFredin, Z, Zemanek, J, Blackburn, C, Strand, E, Abdel-Rahman, A et al. 2020. "Discrete Integrated Circuit Electronics (DICE)." 2020 IEEE High Performance Extreme Computing Conference, HPEC 2020.
dc.contributor.departmentCenter for Brains, Minds, and Machines
dc.relation.journal2020 IEEE High Performance Extreme Computing Conference, HPEC 2020en_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2021-06-23T19:49:02Z
dspace.orderedauthorsFredin, Z; Zemanek, J; Blackburn, C; Strand, E; Abdel-Rahman, A; Rowles, P; Gershenfeld, Nen_US
dspace.date.submission2021-06-23T19:49:04Z
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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