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dc.contributor.authorSterman, Yoav
dc.contributor.authorDemaine, Erik D.
dc.contributor.authorOxman, Neri
dc.date.accessioned2021-11-08T20:00:40Z
dc.date.available2021-11-08T20:00:40Z
dc.date.issued2013-08-04
dc.identifier.urihttps://hdl.handle.net/1721.1/137808
dc.description.abstractOrigami is traditionally implemented in paper of homogeneous material properties. This research explores the use of material with embedded electronics such as PCB (Printed Circuit Boards) as the medium for origami folding in order to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as Light Emitting Diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB Origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process. Copyright © 2013 by ASME.en_US
dc.language.isoen
dc.publisherAmerican Society of Mechanical Engineersen_US
dc.relation.isversionof10.1115/detc2013-12497en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceASMEen_US
dc.titlePCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devicesen_US
dc.typeArticleen_US
dc.identifier.citationSterman, Yoav, Demaine, Erik D. and Oxman, Neri. 2013. "PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices."
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2019-06-20T11:57:39Z
dspace.date.submission2019-06-20T11:57:40Z
mit.licensePUBLISHER_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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