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Advances in infrared GRIN: a review of novel materials towards components and devices

Author(s)
Richardson, Kathleen; Kang, Myungkoo; Sisken, Laura; Yadav, Anupama; Blanco, Cesar; Antia, Michael; Novak, Spencer; Smith, Charmayne; Buff, Andy; Lepicard, Antoine; Dussauze, Marc; Schwarz, Casey M.; Kuebler, Stephen; Grabill, Chris; Pantano, Carlo; Mayer, Theresa; Pogrebnyakov, Alexej V.; Baleine, Clara; Kirk, Andrew; Mensah, Samantha; Driggers, Megan; Hu, Juejun; Lin, Pao-Tai; Agarwal, Anuradha; Li, Cheng; Deng, Weiwei; ... Show more Show less
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Abstract
© COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only. Novel optical materials capable of advanced functionality in the infrared will enable optical designs that can offer lightweight or small footprint solutions in both planar and bulk optical systems. UCF's Glass Processing and Characterization Laboratory (GPCL) with our collaborators have been evaluating compositional design and processing protocols for both bulk and film strategies employing multi-component chalcogenide glasses (ChGs). These materials can be processed with broad compositional flexibility that allows tailoring of their transmission window, physical and optical properties, which allows them to be engineered for compatibility with other homogeneous amorphous or crystalline optical components. This paper reviews progress in forming ChG-based GRIN materials from diverse processing methodologies, including solution-derived ChG layers, poled ChGs with gradient compositional and surface reactivity behavior, nanocomposite bulk ChGs and glass ceramics, and meta-lens structures realized through multiphoton lithography (MPL).
Date issued
2018-05
URI
https://hdl.handle.net/1721.1/137991
Department
MIT Materials Research Laboratory; Massachusetts Institute of Technology. Department of Materials Science and Engineering
Publisher
SPIE
Citation
Richardson, Kathleen, Kang, Myungkoo, Sisken, Laura, Yadav, Anupama, Blanco, Cesar et al. 2018. "Advances in infrared GRIN: a review of novel materials towards components and devices."
Version: Final published version

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