Bundled Gradients Through Contact Via Randomized Smoothing

Author(s)
Suh, Hyung Ju Terry; Pang, Tao; Tedrake, Russ
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Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/
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Date issued
2022
URI
https://hdl.handle.net/1721.1/143989
Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Journal
IEEE Robotics and Automation Letters
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Suh, Hyung Ju Terry, Pang, Tao and Tedrake, Russ. 2022. "Bundled Gradients Through Contact Via Randomized Smoothing." IEEE Robotics and Automation Letters, 7 (2).
Version: Author's final manuscript
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