| dc.contributor.author | Suh, Hyung Ju Terry | |
| dc.contributor.author | Pang, Tao | |
| dc.contributor.author | Tedrake, Russ | |
| dc.date.accessioned | 2022-07-22T17:07:33Z | |
| dc.date.available | 2022-07-22T17:07:33Z | |
| dc.date.issued | 2022 | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/143989 | |
| dc.language.iso | en | |
| dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en_US |
| dc.relation.isversionof | 10.1109/LRA.2022.3146931 | en_US |
| dc.rights | Creative Commons Attribution-Noncommercial-Share Alike | en_US |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-sa/4.0/ | en_US |
| dc.source | MIT web domain | en_US |
| dc.title | Bundled Gradients Through Contact Via Randomized Smoothing | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Suh, Hyung Ju Terry, Pang, Tao and Tedrake, Russ. 2022. "Bundled Gradients Through Contact Via Randomized Smoothing." IEEE Robotics and Automation Letters, 7 (2). | |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
| dc.contributor.department | Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory | |
| dc.relation.journal | IEEE Robotics and Automation Letters | en_US |
| dc.eprint.version | Author's final manuscript | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dc.date.updated | 2022-07-22T16:55:57Z | |
| dspace.orderedauthors | Suh, HJT; Pang, T; Tedrake, R | en_US |
| dspace.date.submission | 2022-07-22T16:56:04Z | |
| mit.journal.volume | 7 | en_US |
| mit.journal.issue | 2 | en_US |
| mit.license | OPEN_ACCESS_POLICY | |
| mit.metadata.status | Authority Work and Publication Information Needed | en_US |
