| dc.contributor.author | Kornbluth, Yosef S | |
| dc.contributor.author | Parameswaran, Lalitha | |
| dc.contributor.author | Mathews, Richard | |
| dc.contributor.author | Racz, Livia M | |
| dc.contributor.author | Velásquez-García, Luis F | |
| dc.date.accessioned | 2022-10-07T13:14:14Z | |
| dc.date.available | 2022-10-07T13:14:14Z | |
| dc.date.issued | 2022 | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/145738 | |
| dc.language.iso | en | |
| dc.publisher | Wiley | en_US |
| dc.relation.isversionof | 10.1002/ADMT.202200097 | en_US |
| dc.rights | Creative Commons Attribution 4.0 International license | en_US |
| dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | en_US |
| dc.source | Wiley | en_US |
| dc.title | Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M and Velásquez-García, Luis F. 2022. "Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering." Advanced Materials Technologies, 7 (8). | |
| dc.contributor.department | Massachusetts Institute of Technology. Microsystems Technology Laboratories | en_US |
| dc.contributor.department | Lincoln Laboratory | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Mechanical Engineering | en_US |
| dc.relation.journal | Advanced Materials Technologies | en_US |
| dc.eprint.version | Final published version | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dc.date.updated | 2022-10-07T12:58:34Z | |
| dspace.orderedauthors | Kornbluth, YS; Parameswaran, L; Mathews, R; Racz, LM; Velásquez-García, LF | en_US |
| dspace.date.submission | 2022-10-07T12:58:35Z | |
| mit.journal.volume | 7 | en_US |
| mit.journal.issue | 8 | en_US |
| mit.license | PUBLISHER_CC | |
| mit.metadata.status | Authority Work and Publication Information Needed | en_US |
