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dc.contributor.advisorLeiserson, Charles E.en_US
dc.contributor.authorPinter, Ron Yairen_US
dc.date.accessioned2023-03-29T15:07:30Z
dc.date.available2023-03-29T15:07:30Z
dc.date.issued1983-08
dc.identifier.urihttps://hdl.handle.net/1721.1/149569
dc.description.abstractPrograms for integrated circuit layout at the module assembly level are typically decomposed into two phases - placement and routing. In this thesis we investigate a third phase which is often implicitly assumed - layer assignment. This thesis studies how layer assignment methodologies interact with placement and routing.en_US
dc.relation.ispartofseriesMIT-LCS-TR-291
dc.titleThe Impact of Layer Assignment Methods on Layout Algorithms for Integrated Circuitsen_US
dc.identifier.oclc10990081


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