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dc.contributor.authorYuan, Mengyang
dc.contributor.authorXie, Qingyun
dc.contributor.authorNiroula, John
dc.contributor.authorChowdhury, Nadim
dc.contributor.authorPalacios, Tomas
dc.date.accessioned2023-04-10T15:12:53Z
dc.date.available2023-04-10T15:12:53Z
dc.date.issued2022-11-01
dc.identifier.issn0741-3106
dc.identifier.issn1558-0563
dc.identifier.urihttps://hdl.handle.net/1721.1/150479
dc.description.sponsorshipNational Aeronautics and Space Administration (NASA)en_US
dc.description.sponsorshipLockheed Martin Corporation under Grant 025570-00036, Air Force Office of Scientific Research (AFOSR) under Grant FA9550-22-1-0367en_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionof10.1109/led.2022.3218671en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttps://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceYuanen_US
dc.subjectElectrical and Electronic Engineeringen_US
dc.subjectElectronic, Optical and Magnetic Materialsen_US
dc.titleGaN Memory Operational at 300 °Cen_US
dc.typeArticleen_US
dc.identifier.citationYuan, Mengyang, Xie, Qingyun, Niroula, John, Chowdhury, Nadim and Palacios, Tomas. 2022. "GaN Memory Operational at 300 °C." IEEE Electron Device Letters, 43 (12).
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.relation.journalIEEE Electron Device Lettersen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.identifier.doi10.1109/LED.2022.3218671
dspace.date.submission2023-04-09T20:22:53Z
mit.journal.volume43en_US
mit.journal.issue12en_US
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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