Show simple item record

dc.contributor.authorChen, Gang
dc.date.accessioned2023-05-31T15:17:32Z
dc.date.available2023-05-31T15:17:32Z
dc.date.issued2022
dc.identifier.urihttps://hdl.handle.net/1721.1/150831
dc.description.abstractAlthough it has been shown experimentally that a temperature discontinuity exists at the liquid-vapor interface during evaporation and condensation, quantitatively modeling this temperature jump has been difficult. The classical Schrage equation does not give enough information to determine the interfacial temperature jump. Starting from the Boltzmann transport equation, this paper establishes three interfacial boundary conditions to connect the temperature, density, and pressure jumps at the liquid-vapor interface to the interfacial mass and heat fluxes: one for the mass flux (the Schrage equation), one for the heat flux, and the third for the density discontinuities. These expressions can be readily coupled to heat and mass transport equations in the continuum of the liquid and the vapor phases, enabling one to determine the values of the interfacial temperature, density, and pressure jumps. Comparison with past experiments is favorable. A thermomolecular emission model, mimicking thermionic emission of electrons, is also presented to gain more molecular-level insights on the thermal evaporation processes.en_US
dc.language.isoen
dc.publisherElsevier BVen_US
dc.relation.isversionof10.1016/J.IJHEATMASSTRANSFER.2022.122845en_US
dc.rightsCreative Commons Attribution-Noncommercial-NoDerivativesen_US
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/en_US
dc.sourcearXiven_US
dc.titleOn the molecular picture and interfacial temperature discontinuity during evaporation and condensationen_US
dc.typeArticleen_US
dc.identifier.citationChen, Gang. 2022. "On the molecular picture and interfacial temperature discontinuity during evaporation and condensation." International Journal of Heat and Mass Transfer, 191.
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.relation.journalInternational Journal of Heat and Mass Transferen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2023-05-31T15:10:39Z
dspace.orderedauthorsChen, Gen_US
dspace.date.submission2023-05-31T15:10:41Z
mit.journal.volume191en_US
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record