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dc.contributor.authorXie, Qingyun
dc.contributor.authorYuan, Mengyang
dc.contributor.authorNiroula, John
dc.contributor.authorSikder, Bejoy
dc.contributor.authorLuo, Shisong
dc.contributor.authorFu, Kai
dc.contributor.authorRajput, Nitul S.
dc.contributor.authorPranta, Ayan Biswas
dc.contributor.authorYadav, Pradyot
dc.contributor.authorZhao, Yuji
dc.contributor.authorChowdhury, Nadim
dc.contributor.authorPalacios, Tomás
dc.date.accessioned2023-07-31T19:27:44Z
dc.date.available2023-07-31T19:27:44Z
dc.date.issued2023-06-11
dc.identifier.urihttps://hdl.handle.net/1721.1/151274
dc.description.sponsorshipNational Aeronautics and Space Administration (NASA)en_US
dc.description.sponsorshipLockheed Martin Corp., AFOSR, Qualcomm Inc.en_US
dc.publisherIEEEen_US
dc.relation.isversionof10.23919/vlsitechnologyandcir57934.2023.10185364en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttps://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceXieen_US
dc.titleTowards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °Cen_US
dc.typeArticleen_US
dc.identifier.citationXie, Qingyun, Yuan, Mengyang, Niroula, John, Sikder, Bejoy, Luo, Shisong et al. 2023. "Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C." 2023 IEEE Symposium on VLSI Technology and Circuits.
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.identifier.doi10.23919/VLSITechnologyandCir57934.2023.10185364
dspace.date.submission2023-07-31T02:52:20Z
mit.journal.volume2023 IEEE Symposium on VLSI Technology and Circuitsen_US
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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