dc.contributor.author | Xie, Qingyun | |
dc.contributor.author | Yuan, Mengyang | |
dc.contributor.author | Niroula, John | |
dc.contributor.author | Sikder, Bejoy | |
dc.contributor.author | Luo, Shisong | |
dc.contributor.author | Fu, Kai | |
dc.contributor.author | Rajput, Nitul S. | |
dc.contributor.author | Pranta, Ayan Biswas | |
dc.contributor.author | Yadav, Pradyot | |
dc.contributor.author | Zhao, Yuji | |
dc.contributor.author | Chowdhury, Nadim | |
dc.contributor.author | Palacios, Tomás | |
dc.date.accessioned | 2023-07-31T19:27:44Z | |
dc.date.available | 2023-07-31T19:27:44Z | |
dc.date.issued | 2023-06-11 | |
dc.identifier.uri | https://hdl.handle.net/1721.1/151274 | |
dc.description.sponsorship | National Aeronautics and Space Administration (NASA) | en_US |
dc.description.sponsorship | Lockheed Martin Corp., AFOSR, Qualcomm Inc. | en_US |
dc.publisher | IEEE | en_US |
dc.relation.isversionof | 10.23919/vlsitechnologyandcir57934.2023.10185364 | en_US |
dc.rights | Creative Commons Attribution-Noncommercial-Share Alike | en_US |
dc.rights.uri | https://creativecommons.org/licenses/by-nc-sa/4.0/ | en_US |
dc.source | Xie | en_US |
dc.title | Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C | en_US |
dc.type | Article | en_US |
dc.identifier.citation | Xie, Qingyun, Yuan, Mengyang, Niroula, John, Sikder, Bejoy, Luo, Shisong et al. 2023. "Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C." 2023 IEEE Symposium on VLSI Technology and Circuits. | |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
dc.eprint.version | Author's final manuscript | en_US |
dc.type.uri | http://purl.org/eprint/type/ConferencePaper | en_US |
eprint.status | http://purl.org/eprint/status/NonPeerReviewed | en_US |
dc.identifier.doi | 10.23919/VLSITechnologyandCir57934.2023.10185364 | |
dspace.date.submission | 2023-07-31T02:52:20Z | |
mit.journal.volume | 2023 IEEE Symposium on VLSI Technology and Circuits | en_US |
mit.license | OPEN_ACCESS_POLICY | |
mit.metadata.status | Authority Work and Publication Information Needed | en_US |