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dc.contributor.authorTorkashvand, Ziba
dc.contributor.authorShayeganfar, Farzaneh
dc.contributor.authorRamazani, Ali
dc.date.accessioned2024-02-23T17:46:05Z
dc.date.available2024-02-23T17:46:05Z
dc.date.issued2024-01-24
dc.identifier.urihttps://hdl.handle.net/1721.1/153561
dc.description.abstractThe micro- and nanoelectromechanical system (MEMS and NEMS) devices based on two-dimensional (2D) materials reveal novel functionalities and higher sensitivity compared to their silicon-base counterparts. Unique properties of 2D materials boost the demand for 2D material-based nanoelectromechanical devices and sensing. During the last decades, using suspended 2D membranes integrated with MEMS and NEMS emerged high-performance sensitivities in mass and gas sensors, accelerometers, pressure sensors, and microphones. Actively sensing minute changes in the surrounding environment is provided by means of MEMS/NEMS sensors, such as sensing in passive modes of small changes in momentum, temperature, and strain. In this review, we discuss the materials preparation methods, electronic, optical, and mechanical properties of 2D materials used in NEMS and MEMS devices, fabrication routes besides device operation principles.en_US
dc.publisherMultidisciplinary Digital Publishing Instituteen_US
dc.relation.isversionofhttp://dx.doi.org/10.3390/mi15020175en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceMultidisciplinary Digital Publishing Instituteen_US
dc.titleNanomaterials Based Micro/Nanoelectromechanical System (MEMS and NEMS) Devicesen_US
dc.typeArticleen_US
dc.identifier.citationMicromachines 15 (2): 175 (2024)en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.mitlicensePUBLISHER_CC
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2024-02-23T15:03:23Z
dspace.date.submission2024-02-23T15:03:23Z
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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