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dc.contributor.authorWei, Lan
dc.contributor.authorDai, Chenyue
dc.contributor.authorPeng, Xuening
dc.contributor.authorTong, Xin
dc.contributor.authorLiu, Can
dc.date.accessioned2025-12-04T16:22:32Z
dc.date.available2025-12-04T16:22:32Z
dc.date.issued2024-10-29
dc.identifier.isbn979-8-4007-1389-7
dc.identifier.urihttps://hdl.handle.net/1721.1/164197
dc.descriptionCHCHI 2024, Shenzhen, Chinaen_US
dc.description.abstractIn spatial design, non-professionals lack effective hands-on opportunities to participate in the design process. Although VR platforms can support spatial design with immersive interaction, existing tools simply provide high-fidelity 3D objects for users to choose and place around. Low-fidelity design approach is rarely supported, nor investigated in this context. In this work, we present a user study comparing low-fidelity and high-fidelity spatial design in VR. Eighteen participants were recruited to use both versions of a prototype with varied geometric fidelity to complete home designs. Their design outcome and intent was evaluated by professional designers. Our findings show, the low-fidelity version allowed participants to think more openly and creatively, leading to a more holistic expression of their design intent and needs, while the high-fidelity version promoted users’ thinking of realistic scenarios. We discuss the design implications and how they can be combined in co-design activities.en_US
dc.publisherACM|The Twelfth International Symposium of Chinese CHIen_US
dc.relation.isversionofhttps://doi.org/10.1145/3758871.3758913en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceAssociation for Computing Machineryen_US
dc.titleLow-Fidelity vs. High-Fidelity Spatial Design in Virtual Reality for Non-professionalsen_US
dc.typeArticleen_US
dc.identifier.citationLan Wei, Chenyue Dai, Xuening Peng, Xin Tong, and Can Liu. 2025. Low-Fidelity vs. High-Fidelity Spatial Design in Virtual Reality for Non-professionals. In Proceedings of the Twelfth International Symposium of Chinese CHI (CHCHI '24). Association for Computing Machinery, New York, NY, USA, 486–498.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Architectureen_US
dc.identifier.mitlicensePUBLISHER_CC
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2025-11-01T07:55:22Z
dc.language.rfc3066en
dc.rights.holderThe author(s)
dspace.date.submission2025-11-01T07:55:22Z
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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