Browsing MIT Open Access Articles by Subject "via inductance"

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    • Fabrication and Characterization of Through-Substrate Interconnects 

      del Alamo, Jesus A.; Wu, Joyce H. (Institute of Electrical and Electronics Engineers, 2010-05)
      We developed a through-substrate copper-damascene interconnect technology in silicon with minimal impedance. Via impedance was extracted using parameter measurements at 50 GHz that were matched to simple circuit models. ...