Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions
Author(s)Daniel, Luca; Hsiao, Yu-Chung; El-Moselhy, Tarek Ali
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In this paper we show how the highly restrictive design rules of the recent sub-micro to nano-scale integrated circuit technologies allow to use a limited number of pre-computed surface charge distributions as a set of fundamental template basis functions in an efficient integral equation based 3D capacitance solver. Several examples verify that our solver can achieve final accuracies of less than 2% using 5times to 30times fewer unknowns than standard piecewise constant basis functions for the same accuracy, resulting in up to 25times speedups.
DepartmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09
Institute of Electrical and Electronics Engineers
Yu-Chung Hsiao, T. El-Moselhy, and L. Daniel. “Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions.” Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on. 2009. 179-182. ©2009 Institute of Electrical and Electronics Engineers.
Final published version
INSPEC Accession Number: 10978758