| dc.contributor.author | Daniel, Luca | |
| dc.contributor.author | Hsiao, Yu-Chung | |
| dc.contributor.author | El-Moselhy, Tarek Ali | |
| dc.date.accessioned | 2010-10-15T18:29:26Z | |
| dc.date.available | 2010-10-15T18:29:26Z | |
| dc.date.issued | 2009-11 | |
| dc.date.submitted | 2009-11 | |
| dc.identifier.isbn | 978-1-4244-4447-2 | |
| dc.identifier.other | INSPEC Accession Number: 10978758 | |
| dc.identifier.uri | http://hdl.handle.net/1721.1/59382 | |
| dc.description.abstract | In this paper we show how the highly restrictive design rules of the recent sub-micro to nano-scale integrated circuit technologies allow to use a limited number of pre-computed surface charge distributions as a set of fundamental template basis functions in an efficient integral equation based 3D capacitance solver. Several examples verify that our solver can achieve final accuracies of less than 2% using 5times to 30times fewer unknowns than standard piecewise constant basis functions for the same accuracy, resulting in up to 25times speedups. | en_US |
| dc.description.sponsorship | Semiconductor Research Corporation | en_US |
| dc.description.sponsorship | Advanced Micro Devices (Firm) | en_US |
| dc.description.sponsorship | Mentor Graphics (Firm) | en_US |
| dc.language.iso | en_US | |
| dc.publisher | Institute of Electrical and Electronics Engineers | en_US |
| dc.relation.isversionof | http://dx.doi.org/10.1109/EPEPS.2009.5338449 | en_US |
| dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US |
| dc.source | IEEE | en_US |
| dc.title | Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Yu-Chung Hsiao, T. El-Moselhy, and L. Daniel. “Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions.” Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on. 2009. 179-182. ©2009 Institute of Electrical and Electronics Engineers. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
| dc.contributor.approver | Daniel, Luca | |
| dc.contributor.mitauthor | Daniel, Luca | |
| dc.contributor.mitauthor | Hsiao, Yu-Chung | |
| dc.contributor.mitauthor | El-Moselhy, Tarek Ali | |
| dc.relation.journal | IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09 | en_US |
| dc.eprint.version | Final published version | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dspace.orderedauthors | Hsiao, Yu-Chung; El-Moselhy, Tarek; Daniel, Luca | en |
| dc.identifier.orcid | https://orcid.org/0000-0002-5880-3151 | |
| mit.license | PUBLISHER_POLICY | en_US |
| mit.metadata.status | Complete | |