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dc.contributor.authorDaniel, Luca
dc.contributor.authorHsiao, Yu-Chung
dc.contributor.authorEl-Moselhy, Tarek Ali
dc.date.accessioned2010-10-15T18:29:26Z
dc.date.available2010-10-15T18:29:26Z
dc.date.issued2009-11
dc.date.submitted2009-11
dc.identifier.isbn978-1-4244-4447-2
dc.identifier.otherINSPEC Accession Number: 10978758
dc.identifier.urihttp://hdl.handle.net/1721.1/59382
dc.description.abstractIn this paper we show how the highly restrictive design rules of the recent sub-micro to nano-scale integrated circuit technologies allow to use a limited number of pre-computed surface charge distributions as a set of fundamental template basis functions in an efficient integral equation based 3D capacitance solver. Several examples verify that our solver can achieve final accuracies of less than 2% using 5times to 30times fewer unknowns than standard piecewise constant basis functions for the same accuracy, resulting in up to 25times speedups.en_US
dc.description.sponsorshipSemiconductor Research Corporationen_US
dc.description.sponsorshipAdvanced Micro Devices (Firm)en_US
dc.description.sponsorshipMentor Graphics (Firm)en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/EPEPS.2009.5338449en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleEfficient capacitance solver for 3D interconnect based on template-instantiated basis functionsen_US
dc.typeArticleen_US
dc.identifier.citationYu-Chung Hsiao, T. El-Moselhy, and L. Daniel. “Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions.” Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on. 2009. 179-182. ©2009 Institute of Electrical and Electronics Engineers.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverDaniel, Luca
dc.contributor.mitauthorDaniel, Luca
dc.contributor.mitauthorHsiao, Yu-Chung
dc.contributor.mitauthorEl-Moselhy, Tarek Ali
dc.relation.journalIEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsHsiao, Yu-Chung; El-Moselhy, Tarek; Daniel, Lucaen
dc.identifier.orcidhttps://orcid.org/0000-0002-5880-3151
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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