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dc.contributor.authorJoshi, Ajay J.
dc.contributor.authorKim, Byungsub
dc.contributor.authorStojanovic, Vladimir Marko
dc.date.accessioned2010-10-20T12:44:48Z
dc.date.available2010-10-20T12:44:48Z
dc.date.issued2009-09
dc.date.submitted2009-08
dc.identifier.isbn978-0-7695-3847-1
dc.identifier.issn1550-4794
dc.identifier.otherINSPEC Accession Number: 10869173
dc.identifier.urihttp://hdl.handle.net/1721.1/59419
dc.description.abstractIn a power and area constrained multicore system, the on-chip communication network needs to be carefully designed to maximize the system performance and programmer productivity while minimizing energy and area. In this paper, we explore the design of energy-efficient low-diameter networks (flattened butterfly and Clos) using equalized on-chip interconnects. These low-diameter networks are attractive as they can potentially provide uniformly high throughput and low latency across various traffic patterns, but require efficient global communication channels. In our case study, for a 64-tile system, the use of equalization for the wire channels in low-diameter networks provides 2x reduction in power with no loss in system performance compared to repeater-inserted wire channels. The use of virtual channels in routers further reduces the power of the network by 25-50% and wire area by 2x.en_US
dc.description.sponsorshipIntel Corporationen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/HOTI.2009.13en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.subjecton-chip networken_US
dc.subjectmulticore systemen_US
dc.subjectlow poweren_US
dc.subjectequalized interconnectsen_US
dc.titleDesigning Energy-Efficient Low-Diameter On-chip Networks with Equalized Interconnectsen_US
dc.typeArticleen_US
dc.identifier.citationJoshi, A., B. Kim, and V. Stojanovic. “Designing Energy-Efficient Low-Diameter On-Chip Networks with Equalized Interconnects.” High Performance Interconnects, 2009. HOTI 2009. 17th IEEE Symposium on. 2009. 3-12. © Copyright 2010 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverStojanovic, Vladimir Marko
dc.contributor.mitauthorJoshi, Ajay J.
dc.contributor.mitauthorKim, Byungsub
dc.contributor.mitauthorStojanovic, Vladimir Marko
dc.relation.journal17th IEEE Symposium on High Performance Interconnects, 2009. HOTI 2009.en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsJoshi, A.; Kim, B.; Stojanovic, V.en
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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