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dc.contributor.authorStojanovic, Vladimir Marko
dc.contributor.authorKim, Byungsub
dc.date.accessioned2010-10-21T20:44:52Z
dc.date.available2010-10-21T20:44:52Z
dc.date.issued2009-05
dc.date.submitted2009-02
dc.identifier.isbn978-1-4244-3458-9
dc.identifier.otherINSPEC Accession Number: 10727898
dc.identifier.urihttp://hdl.handle.net/1721.1/59456
dc.description.abstractThis paper presents a transceiver for fast and energy-efficient global on-chip communication, consisting of a nonlinear charge-injecting (CI) 3-tap transmit filter (TX) and a sampling receiver (RX) with transimpedance pre-amplifier (TIA). Recently, pre-emphasis techniques have demonstrated significantly better energy-efficiency than repeater interconnects. To further improve energy-efficiency over pre-emphasis techniques that require analog subtraction, our TX selects a pattern-dependent current to inject into the wire, performing feed-forward equalization (FFE) while mitigating the nonlinearity of the driver. This 3-tap charge-injecting (CI) FFE enables stronger equalization than the capacitively driven TX or edge-detection pre-emphasis, achieving data-rate of 4 Gb/s over a 1 cm on-chip wire. The TIA at RX improves bandwidth, signal amplitude, and reduces bias power, breaking the trade-offs in conventional resistor termination, and mitigates equalized signal degradation due to impedance changes in dynamic current sensing.en_US
dc.description.sponsorshipMassachusetts Institute of Technology. Center for Integrated Circuits and Systemsen_US
dc.description.sponsorshipIntel Corporationen_US
dc.description.sponsorshipSemiconductor Research Corporationen_US
dc.description.sponsorshipNational Semiconductor Corporation. Trusted Foundry Servicesen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ISSCC.2009.4977310en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleA 4Gb/s/ch 356fJ/b 10mm equalized on-chip interconnect with nonlinear charge-injecting transmit filter and transimpedance receiver in 90nm CMOSen_US
dc.typeArticleen_US
dc.identifier.citationByungsub Kim, and V. Stojanovic. “A 4Gb/s/ch 356fJ/b 10mm equalized on-chip interconnect with nonlinear charge-injecting transmit filter and transimpedance receiver in 90nm CMOS.” Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International. 2009. 66-67,67a. ©2009 Institute of Electrical and Electronics Engineers.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverStojanovic, Vladimir Marko
dc.contributor.mitauthorStojanovic, Vladimir Marko
dc.contributor.mitauthorKim, Byungsub
dc.relation.journalIEEE International Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsByungsub Kim; Stojanovic, V.en
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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