Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices
Author(s)Subbarao, Samuel P.; Bahlke, Matthias Erhard; Kymissis, Ioannis
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We present an approach, which is compatible with both glass and polymer substrates, to in-laboratory handling and intra-laboratory shipping of air-sensitive organic semiconductors. Encapsulation approaches are presented using polymer/ceramic and polymer/metal thin-film barriers using commercially available materials and generally available laboratory equipment. A technique for depositing an opaque vapor barrier, a transparent vapor barrier, and an approach to storing and shipping air-sensitive thin-film organic semiconductor devices on both polymer and glass substrates are presented. Barrier performance in air was tested using organic light-emitting diodes (OLEDs) as test devices. The half-life performance of OLEDs on plastic substrates in air exceeded 700 h, and that on glass exceeded 500 h. Commercially available heat-seal barrier bag systems for device shipping and storage in air were tested using a thin film of metallic calcium to test water permeation. More than four months of storage of a metallic calcium film in a heat-sealed foil bag was demonstrated in the best storage system. These approaches allow for the encapsulation of samples for longer duration testing and transportation than otherwise possible.
DepartmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
IEEE Transactions on Electron Devices
Institute of Electrical and Electronics Engineers
Subbarao, S.P., M.E. Bahlke, and I. Kymissis. “Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices.” Electron Devices, IEEE Transactions On 57.1 (2010) : 153-156. © 2010 IEEE.
Final published version
INSPEC Accession Number: 11024604