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dc.contributor.authorLee, Kyeong-Jae
dc.contributor.authorQazi, Masood
dc.contributor.authorKong, Jing
dc.contributor.authorChandrakasan, Anantha P.
dc.date.accessioned2012-05-22T19:39:02Z
dc.date.available2012-05-22T19:39:02Z
dc.date.issued2010-10
dc.date.submitted2010-08
dc.identifier.issn0018-9383
dc.identifier.issn1557-9646
dc.identifier.urihttp://hdl.handle.net/1721.1/70907
dc.description.abstractIn this paper, we characterize the performance of monolithically integrated graphene interconnects on a prototype 0.35-μm CMOS chip. The test chip implements an array of transmitter/receivers to analyze the end-to-end data communication on graphene wires. Large-area graphene sheets are first grown by chemical vapor deposition, which are then subsequently processed into narrow wires up to 1 mm in length. A low-swing signaling technique is applied, which results in a transmitter energy of 0.3-0.7 pJ/b·mm[superscript -1] and a total energy of 2.4-5.2 pJ/b·mm[superscript -1]. Bit error rates below 2 × 10[superscript -10] are measured using a 2[superscript 31] - 1 pseudorandom binary sequence. Minimum voltage swings of 100 mV at 1.5-V supply and 500 mV at 3.3-V supply have also been demonstrated. At present, the graphene wire is largely limited by its growth quality and high sheet resistance.en_US
dc.description.sponsorshipInterconnect Focus Center (United States. Defense Advanced Research Projects Agency and Semiconductor Research Corporation)en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ted.2010.2083667en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleLow-Swing Signaling on Monolithically Integrated Global Graphene Interconnectsen_US
dc.typeArticleen_US
dc.identifier.citationLee, Kyeong-Jae et al. “Low-Swing Signaling on Monolithically Integrated Global Graphene Interconnects.” IEEE Transactions on Electron Devices 57.12 (2010): 3418–3425. Web.© 2010 IEEE.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverKong, Jing
dc.contributor.mitauthorLee, Kyeong-Jae
dc.contributor.mitauthorQazi, Masood
dc.contributor.mitauthorKong, Jing
dc.contributor.mitauthorChandrakasan, Anantha P.
dc.relation.journalIEEE Transactions on Electron Devicesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsLee, Kyeong-Jae; Qazi, Masood; Kong, Jing; Chandrakasan, Anantha P.en
dc.identifier.orcidhttps://orcid.org/0000-0002-5977-2748
dc.identifier.orcidhttps://orcid.org/0000-0003-0551-1208
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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