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dc.contributor.authorXia, Ling
dc.contributor.authordel Alamo, Jesus A.
dc.date.accessioned2012-07-12T15:43:23Z
dc.date.available2012-07-12T15:43:23Z
dc.date.issued2010-05
dc.identifier.isbn9781424459193
dc.identifier.issn1092-8669
dc.identifier.otherINSPEC Accession Number: 11485059
dc.identifier.urihttp://hdl.handle.net/1721.1/71592
dc.description.abstractAs in Si CMOS, the incorporation of mechanical strain offers the possibility of improving the performance of III-V field effect transistors (FETs). Quantifying its potential and providing fundamental understanding of the impact of strain are the goals of this study. This paper reports an investigation of the impact of <;110> uniaxial strain on n-type InAlAs/InGaAs HEMTs with a 70% InAs channel core. The main impact of strain is found to be a modification of the electron effective mass and mobility. A comparison between the effect of <;110> strain in Si and InGaAs suggests that strain engineering can indeed be leveraged to improve transport properties in deeply scaled InGaAs FETs.en_US
dc.description.sponsorshipIntel Corporationen_US
dc.description.sponsorshipSemiconductor Research Corporation. Center for Materials, Structures and Devicesen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/ 10.1109/ICIPRM.2010.5516249en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleMobility enhancement in indium-rich N-channel In[subscript x]Ga[subscript 1-x]As HEMTs by application of <110> uniaxial strainen_US
dc.title.alternativeMobility enhancement in indium-rich N-channel InxGa1-xAs HEMTs by application of <110> uniaxial strainen_US
dc.typeArticleen_US
dc.identifier.citationXia, Ling, and Jesus. A. del Alamo. “Mobility Enhancement in Indium-rich N-channel In[subscript x]Ga[subscript 1-x]As HEMTs by Application of <110> Uniaxial Strain.” IEEE, Proceedings of the 2010 International Conference on Indium Phosphide & Related Materials (IPRM), 22nd IPRM, May31-June 4, 2010, Takamatsu Symbol Tower, Kagawa, Japan. 1–4. Web. ©2010 IEEE.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.contributor.approverdel Alamo, Jesus A.
dc.contributor.mitauthorXia, Ling
dc.contributor.mitauthordel Alamo, Jesus A.
dc.relation.journalProceedings of the 2010 International Conference on Indium Phosphide & Related Materials (IPRM), 22nd IPRM, May 31-June 4, 2010, Takamatsu Symbol Tower, Kagawa, Japanen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
dspace.orderedauthorsXia, Ling; del Alamo, Jesus. A.en
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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