Time evolution of electrical degradation under high-voltage stress in GaN high electron mobility transistors
Author(s)
Joh, Jungwoo; del Alamo, Jesus A.
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In this work, we investigate the time evolution of electrical degradation of GaN high electron mobility transistors under high voltage stress in the OFF state. We found that the gate current starts to degrade first, followed by degradation in current collapse and eventually permanent degradation in I[subscript D]. We also found that the time evolution of gate current degradation is unaffected by temperature, while drain current degradation is thermally accelerated.
Date issued
2011-06Department
Massachusetts Institute of Technology. Microsystems Technology LaboratoriesJournal
IEEE International Reliability Physics Symposium 2011 (IRPS)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Joh, Jungwoo, and Jesus A. del Alamo. “Time Evolution of Electrical Degradation Under High-voltage Stress in GaN High Electron Mobility Transistors.” IEEE International Reliability Physics Symposium 2011 (IRPS). 4E.3.1–4E.3.4.
Version: Author's final manuscript
ISBN
978-1-4244-9111-7
978-1-4244-9113-1
ISSN
1541-7026