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dc.contributor.authorYao, Weijun
dc.contributor.authorBascunan, Juan
dc.contributor.authorHahn, Seung-Yong
dc.contributor.authorIwasa, Yukikazu
dc.date.accessioned2012-09-19T16:08:48Z
dc.date.available2012-09-19T16:08:48Z
dc.date.issued2009-07
dc.date.submitted2008-08
dc.identifier.issn1051-8223
dc.identifier.urihttp://hdl.handle.net/1721.1/73046
dc.description.abstractThis paper describes a technique to superconductively splice multifilament MgB2 wires. To date the technique has achieved joints capable of carrying a superconducting current of 200 A at 10 K in self field. Joints details, as well as testing methods and results are presented here.en_US
dc.description.sponsorshipNational Institute of Biomedical Imaging and Bioengineering (U.S.)en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/tasc.2009.2019063en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleA Superconducting Joint Technique for MgB[subscript 2] Round Wiresen_US
dc.typeArticleen_US
dc.identifier.citationWeijun Yao et al. “A Superconducting Joint Technique for MgB2 Round Wires.” IEEE Transactions on Applied Superconductivity 19.3 (2009): 2261–2264. © Copyright 2009 IEEEen_US
dc.contributor.departmentFrancis Bitter Magnet Laboratory (Massachusetts Institute of Technology)en_US
dc.contributor.mitauthorYao, Weijun
dc.contributor.mitauthorBascunan, Juan
dc.contributor.mitauthorHahn, Seung-Yong
dc.contributor.mitauthorIwasa, Yukikazu
dc.relation.journalIEEE Transactions on Applied Superconductivityen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsWeijun Yao; Bascunan, J.; Seungyong Hahn, J.; Iwasa, Y.en
dc.identifier.orcidhttps://orcid.org/0000-0001-5712-7350
mit.licensePUBLISHER_POLICYen_US


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