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Light up the Future of Silicon Microprocessors

Author(s)
Liu, Jifeng; Michel, Jurgen; Beals, Mark A.; Kimerling, Lionel C.
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.

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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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Abstract
For decades, the performance of Si microprocessors has increased exponentially following "Moore's Law" by shrinking the dimensions of transistors. However, the progress in microchip performance has become stagnant since 2004 despite the continued device dimension shrinkage mainly due to power consumption and latency issues in traditional electronic interconnects that ended clock frequency scaling. It has become increasingly clear that parallelism is replacing traditional clock frequency scaling, and electronic-photonic synergy that takes the advantage of high bandwidth and energy-efficient photonic interconnects, is the key to high functionality extension of Moore's Law. We present an overview on the recent progress in Si photonic devices and their integration with CMOS fabrication process, including high performance waveguides, couplers, filters, modulators and photodetectors on a Si platform. Photonic data links based on these integrated photonic devices provide large bandwidth and low energy consumption for future generations of microprocessors.
Date issued
2009
URI
http://hdl.handle.net/1721.1/79693
Department
MIT Materials Research Laboratory; Massachusetts Institute of Technology. Department of Materials Science and Engineering; Massachusetts Institute of Technology. Microphotonics Center
Journal
ECS Transactions
Publisher
The Electrochemical Society
Citation
Liu, Jifeng, Mark Beals, Jurgen Michel, and Lionel Kimerling. “Light up the Future of Silicon Microprocessors.” In ECS Transactions, 17-28. © 2009 ECS - The Electrochemical Society
Version: Final published version
ISSN
1938-5862
1938-6737

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