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dc.contributor.authorRuan, Shiyun
dc.contributor.authorSchuh, Christopher A
dc.date.accessioned2013-08-05T16:19:23Z
dc.date.available2013-08-05T16:19:23Z
dc.date.issued2012-04
dc.date.submitted2011-12
dc.identifier.issn0884-2914
dc.identifier.issn2044-5326
dc.identifier.urihttp://hdl.handle.net/1721.1/79781
dc.description.abstractNanostructured Al–Mn alloys are proposed as high-strength low-density materials, which can be electroformed (i.e., produced electrolytically and removed from the substrate) from ionic liquid. A variety of current waveforms, including direct current (DC) and pulsed current (PC), are used to electrodeposit nanostructured Al–Mn alloys, with some PC methods producing significant improvements in film ductility. Transmission electron microscopy observations point to a number of structural advantages induced by PC that apparently ductilize the Al–Mn alloys: (i) grain refinement to the nanocrystalline range without the introduction of a competing amorphous phase, (ii) unimodal nanocrystalline grain size distribution, and (iii) more homogeneous structure. The significant increase in apparent ductility in the PC alloys is also apparently related to stress- or deformation-induced grain growth, which leads to alloys with unique combinations of specific hardness and film ductility.en_US
dc.description.sponsorshipUnited States. Army Research Office (Contract W911NF-07-D-0004) (Massachusetts Institute of Technology. Institute for Soldier Nanotechnologies)en_US
dc.language.isoen_US
dc.publisherCambridge University Press (Materials Research Society)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1557/jmr.2012.105en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceMIT web domainen_US
dc.titleTowards electroformed nanostructured aluminum alloys with high strength and ductilityen_US
dc.typeArticleen_US
dc.identifier.citationRuan, Shiyun, and Christopher A. Schuh. “Towards electroformed nanostructured aluminum alloys with high strength and ductility.” Journal of Materials Research 27, no. 12 (June 24, 2012): 1638-1651. © Materials Research Society 2012en_US
dc.contributor.departmentMassachusetts Institute of Technology. Institute for Soldier Nanotechnologiesen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.mitauthorRuan, Shiyunen_US
dc.contributor.mitauthorSchuh, Christopher A.en_US
dc.relation.journalJournal of Materials Researchen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsRuan, Shiyun; Schuh, Christopher A.en_US
dc.identifier.orcidhttps://orcid.org/0000-0001-9856-2682
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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